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| Product Name: |
semiconductor package
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| Specifications |
semiconductor package |
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| Various types of packing can be provided, including Side Braze DIP, CerDIP, LCC/ QFN, LDCC/CFP, CPGA, CerQuad, SOIC, CerPac, MCM, TO, matching ceramic lids and combo lids, most of which are from well-known manufacturers such as Kyocera, NTK, HCC, Williams, Mini-Systems and so on. Meanwhile, acco***nying Certificates-of-Conformance with any order. |
| Company: |
Suny Technologies
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| Contact: |
Ms. Fiona Zhang |
| Address: |
#55 XingShiKou Road, HaiDian District, |
| Postcode: |
100195 |
| Tel: |
86-10-88863535-8622 |
| Fax: |
86-10-88863232 |
| E-mail: |
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