Suny Technologies

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semiconductor package
Specification: semiconductor package
Detail: Various types of packing can be provided, including Side Braze DIP, CerDIP, LCC/ QFN, LDCC/CFP, CPGA, CerQuad, SOIC, CerPac, MCM, TO, matching ceramic lids and combo lids, most of which are from well-known manufacturers such a...


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